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Reflow soldering processes : SMT, BGA, CSP and flip chip...

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Reflow soldering processes : SMT, BGA,...

Reflow soldering processes : SMT, BGA, CSP and flip chip technologies

Ning-Cheng Lee

4.0 / 5.0

यह पुस्तक आपको कितनी अच्छी लगी?

फ़ाइल की गुणवत्ता क्या है?

पुस्तक की गुणवत्ता का मूल्यांकन करने के लिए यह पुस्तक डाउनलोड करें

डाउनलोड की गई फ़ाइलों की गुणवत्ता क्या है?

श्रेणियाँ:

साल:

2002

प्रकाशन:

Newnes

भाषा:

english

पृष्ठ:

273

ISBN 10:

008049224X

ISBN 13:

9780080492247

फ़ाइल:

PDF, 12.65 MB

IPFS:

,

english, 2002

ऑनलाइन पढ़ें

में रूपांतरण जारी है

में रूपांतरण विफल रहा

आप के लिए दिलचस्प हो सकता है

IPC — IPC-7711 / IPC-7721: Rework, Modification and Repair of Electronic Assemblies (IPC-7711B / IPC-7721B)

FK Pan, Dell Hsu, Stanley Lin — SMT Application Notes for BGA / BGA 表面黏着作业说明书

— Basic Electronic Components & Hardware I

— Soldering of Electrical and Electronic Assemblies MIL-HDBK-2000 US DOD

上坂冬子著 / 巩长金译 — 男装女谍川岛芳子传

陶宗儀 — 說郛第六册

陶宗儀 — 說郛第十一册

SCILLC — Soldering and Mounting Techniques. Reference Manual

John H. Lau — Flip Chip Technologies

John H. Lau, Ricky S.W. Lee, Ricky S. Lee — Chip Scale Package: Design, Materials, Process, Reliability, and Applications

R. S. KHANDPUR — Printed Circuit Boards: Design, Fabrication, Assembly and Testing

John H. Lau — Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies

Ning-Cheng Lee PhD — Reflow Soldering Processes

John Traister (Auth.) — Design Guidelines for Surface Mount Technology

Balázs Illés, Oliver Krammer, Attila Geczy — Reflow Soldering: Apparatus and Heat Transfer Processes

M. Datta, Tetsuya Osaka, J. Walter Schultze — Microelectronic packaging

K.N. Subramanian, KN Subramanian — Lead-Free Electronic Solders: A Special Issue of the Journal of Materials Science: Materials in Electronics

Andrew E. Perkins, Suresh K. Sitaraman (auth.) — Solder Joint Reliability Prediction for Multiple Environments

Jennie S. Hwang — Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly

Sheng Liu, Yong Liu(auth.) — Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing

John Bird — Engineering Mathematics, 4ed. - Solution Manual

Mike Judd and Keith Brindley (Auth.) — Soldering in Electronics Assembly

Rudolf Strauss — SMT Soldering Handbook

MIKE JUDD, Keith Brindley — Soldering in electronics assembly

Karl J. Puttlitz, Kathleen A. Stalter — Handbook of Lead-Free Solder Technology for Microelectronic Assemblies

Glenn R. Blackwell — The electronic packaging handbook

Ricky Lee S.W. — Solder joint reliability

David M. Jacobson, Giles Humpston — Principles of Soldering

Dongkai Shangguan — Lead-free Solder Interconnect Reliability

Gene B. Williams, Joseph Desposito — Electronics Repair Manual

Li, Suny — SiP System-in-Package Design and Simulation: Mentor EE Flow Advanced Design Guide

Jasbir Bath — Lead-free Soldering Process Development and Reliability

沈西城 — 香港名作家韻事/香港名作家韵事

Phan Cong-Vinh — Autonomic Networking-on-Chip: Bio-Inspired Specification, Development, and Verification

Andrea Chen, Randy Hsiao-Yu Lo — Semiconductor Packaging: Materials Interaction and Reliability

King-Ning Tu — Solder Joint Technology

Brian Jepson, Tyler Moskowite, Gregory Hayes — Learn to Solder: Tools and Techniques for Assembling Electronics

Charles Pfeil — BGA Breakouts and Routing: Effective Design Methods for Very Large BGAs

Norman Ahlhelm — An Introduction to High Reliability Soldering and Circuit Board Repair

Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, Hongtao Ma (auth.) — Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability

N Ahlhelm — An Introduction to High Reliability Soldering and Circuit Board Repair

Winstanley, Alan — The basic soldering guide handbook

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